Microtek’s wire bonding services provide customers with considerable scope and flexibility in product design. We work closely with our customers to develop the best solutions for their designs. In addition to our standard offerings, we can develop sophisticated solutions to meet customers’ specific needs.
Wire bonding is used throughout the microelectronics industry as a means of interconnecting chips, substrates, and output pins. It is generally considered the most cost-effective and flexible interconnect technology used in the assembly of semiconductor packaging.
Although flip chip applications are growing, wire bonding continues to produce the vast majority of interconnects, currently responsible for more than 90% of today’s chip attachments. The wire forms the connections between the bond pad on the IC and the substrate/PCB.
Wire materials include Gold (Au), Silver (Ag), Copper (Cu) and Aluminum (Al). Copper wire is becoming more popular due to its stability and price in comparison to gold.
Example attachment techniques include ball bonding and wedge bonding. Ball bonding is the most common method of wire bonding. Automatic thermosonic gold ball bonding is a high-yield interconnect process that uses heat and ultrasonic energy to form metallurgical bonds. Bonds can be made quickly and with ease. However, this method is restricted to gold and copper wire, heat is necessary and size requirements of pads are usually larger than those required for wedge bonding
Wedge bonding can be a slower process. However, pad size can be smaller, wires can be larger in diameter and heat is not always necessary.
Microtek has both semi-automatic and fully automatic wire bonding equipment and performs Gold, Aluminum, or Copper wire bonding services (ball or wedge bonding) as well as ribbon bonding. This enables us to fully accommodate the needs of our customers from R&D to prototype to high volume.
The Hesse Mechatronics Bondjet BJ855 is the latest generation of fully automated fine wire bonders featuring wedge to wedge and ball to wedge bondheads, optimized pattern recognition, and ribbon bond capabilities. Hesse offers automation concepts individually adapted for every application, the fastest bonding speed in the industry, the largest working area and the greatest axis accuracy.
The K&S IConn Automatic WireBonder is the leading generation of semiconductor assembly equipment and is designed to meet all cutting-edge wire bonding challenges.
TPT HB16 Semi-Automatic Wire Bonder is bench top size with a motorized Y and Z axis. It is great for pilot and small-scale production runs and creates consistent and repeatable wire bonds with ease.
With the XYZTEC Condor Sigma Pull and Shear tester, Microtek can perform pull tests with a higher degree of consistency over what is possible when testing manually.
In addition to wirebonding services, Microtek can also provide customer solutions for applications in:
- • Die Attach, Die Sorting, Flip-Chip, MEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID, Sensor Assembly, Adhesive Bonding, Eutectic Bonding, Laser Solder Attach.