Panasonic MD-P200 Die Bonder

• • “Panasonic’s MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.” 2023 Panasonic Corporation of North America.
  • <https://na.panasonic.com/us/factory-equipment-solutions/electronics-assembly-manufacturing-technologies/microelectronics/md-p200-die-bonder>

Panasonic NPM-W2 Pick and Place

• • The NPM-W2 features a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurements.
  • <https://na.panasonic.com/us/factory-equipment-solutions/electronics-assembly-manufacturing-technologies/surface-mount-technology-smt/npm-w2-versatile-platform?gclid=Cj0KCQjw1_SkBhDwARIsANbGpFuvXeUyX7Ty8hNu9k5ONFInXQ1znnRgivkBmsYOL2Ejo7hx8g1Vy9UaAvyIEALw_wcB&gclsrc=aw.ds>

Panasonic PSX/307 Plasma Cleaner

• • “The PSX307 Plasma Cleaner’s parallel plate chamber technology delivers superior etch uniformity over conventional batch systems. Experience surface cleaning before wirebond or flip-chip attach and surface activation and improved underfill wettability and mold encapsulation.” 2023 Panasonic Corporation of North America.
  • <https://na.panasonic.com/us/factory-equipment-solutions/electronics-assembly-manufacturing-technologies/microelectronics/psx307psx307a-plasma-cleaner>

Asymtek Spectrum II S2-900 Precision Fluid Dispensing System

• • Nordson’s Spectrum II S2-900 Precision Fluid Dispensing systems provides fast and precise narrow gap dispensing.
  • < https://www.nordson.com/en/products/electronics-solutions-products/asymtek-spectrum-ii-s2-900-precision-fluid-dispensing-system>

Essemtec Spider Epoxy Dispenser

• • Essemtec’s Spider is a high speed dispenser with a “wide range of dispensing applications such as Solder Past and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing vi laser height mapping and more.” 2023 Essemtec
  • <https://essemtec.com/en/products/dispensing/spider/>

Hesse Bondjet BJ855

• • The Bondjet BJ55 is a high speed fully automatic fine wire bonder with wedge-wedge and ball-wedge capabilities. It is characterized by optimized pattern recognition, software features, largest working area, and greatest axis accuracy.
  • < https://www.hesse-mechatronics.com/en/products/fine-wire-bonder/bj855/>